Chip Backdoor Verification
Discussions center on the challenges of detecting hidden backdoors, tampering, or rogue features in chips and PCBs, including skepticism about verification methods like X-raying, reverse engineering, and supply chain risks.
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Tell me how you propose to verify that the circuitry inside the chip hasn't been invisibly tampered with?
The key is ,,inside chips''. There's no reason to do those bad things on the die using an extra chip, as it's too easy to prove.
Is that all that secret though? Can't you buy radiation-hardened versions of chips if you want to?
Surely this doesn't protect you if there is hidden code on the chip?
Because using a 3rd party design you have to ask or guess what each chip does, and they might not want to tell you everything for IP reasons. When you create your own board, you know what every little chip and trace does exactly, and it's a lot easier to detect a rogue chip.
How would you know that other than the assurances of the company that designed the chip? They could easily insert a few gates in the layout to subvert protections under the right conditions.
Is it common to put fake features in silicon to make reverse engineering harder?
How do you tell US chips are not backdoored?
Could be the processors as well, better to forge the chips by hand to be sure.
Look I worked at a company that built boards in China. Every board is xrayed to verify every level of the board for every trace. They are matched vs. known good perfect board. If anything is wrong the board is destroyed. The boards I am talking about where complex 26+ layer boards which is way more then any standard motherboard. HW wise this is not impossiable, just improbable. The better method would be in software, replacing the on board system management software (intel ME) for example with a